Die Products Assembly Methods
Chip-on-Board (COB) Assembly Tutorial
COB provides the capability to perform direct chip to chip wiring that facilitates improved performance and strong functional integration in many modern high speed applications.
System-in-Package (SiP) Assembly Tutorial
Stacked, or three-dimensional (3D), multichip packaging methodologies have recently become mainstream, high-volume techniques of choice in helping system designers restrain the size, weight, power consumption, and cost of small, portable, and wireless consumer devices.
Flip Chip Assembly Process Overview
Flip chip assembly offers optimized electrical performance in addition to optimized miniaturization.
Other Assembly Resources
Overview of Challenges in Bare Die Mounting (pdf), article by Larry Gilg, DPC