Die/Wafer Handling
Die/Wafer Storage, Handling, and Shipping Contents
Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263.
Product must be handled only in a class 10,000 or better designated clean room environment.
Ultraviolet (UV) sensitive products (e.g., EPROM) need to be handled in a manner that minimizes the exposure of the product to UV light.
Automated Wafer and Die Handling systems are readily available and provide the highest degree of protection and consistency to the handling operation.
Wafer Handling:
Wafers should be handled by limited access tweezers or vacuum wand.
Extra care must be taken when handling thin wafers as they can be easily broken.
Die Handling:
Singulated die are not to be handled with tweezers.
A vacuum wand with a non-metallic ESD protected tip should be used.
Vacuum wand for handling wafers and singulated die.