Low Cost
Intro to Die Products Contents
Lower Cost of Ownership
Most notable in high volume applications where density is required and high yield silicon is implemented. The lower cost of ownership takes into consideration substrate, assembly, system test, equipment utilization, rework and increased product value. In addition, the die product costs are typically lower than the package equivalent.
Improvements in ownership costs:
- Higher levels of integration
- Substrate size/cost
- Assembly/manufacturing process
- Time to market
- Product value
- Features per die area & weight