Encapsulation:

• Shall be free of holes, cracks and discontinuities.
• Shall completely cover the die top and sides.
• All wire bonds on the die and the substrate shall be covered.
• The encapsulation shall not be tacky or soft.

There shall be no voids or pinholes that expose wire or die.

Note: Capping of voids, bubbles, or pinholes shall not be acceptable.

Encapsulation shall be well adhered to the substrate with no evidence of delamination before or after curing.

Encapsulation shall not flow into plated through holes, whether used or unused, on CERAMIC substrates.

Encapsulation is "Acceptable" in plated through holes, "Only on Laminate substrates".

Encapsulation flow onto pads to be soldered shall not reduce pad area by more than 20 percent.

Encapsulation flow onto test points shall not reduce pad area by more than 20 percent.