Within 10 mils spherical distance from bond perimeter bonding wires shall not come closer than one wire diameter to another wire.  (except where wires are connected to common circuitry, or insulated wires are used)

Bonding wires in a single level package shall not be crossed. (except where wires are connected to common circuitry, or insulated wires are used)

RF/Microwave devices; 

Bonds shall be placed so that the separation between bonds, or the bond and exposed metallization not connected to it, is greater than 1 mil or 0.1 mil for insulated wire.