System in Package (SiP) Module Testing
System in Package (SiP) Assembly Contents
For best results at module test, the goal is to apply all Reliability Screens & Test Methods (RS&TM) from package test back at wafer test for each die in the stack - or show quality and reliability equivalence.
The requirement for fully conditioned die is that the stack solution providers need to acquire die that have been fully tested and screened in wafer form for thinning, which makes die level KGD processes problematic.
The stack solution provider must be able to perform a cost effective reduced suite of reliability screens and test methods at final test. At the minimum, the module test must verify connections, verify fundamental functionalityand enable chip level diagnostics. Compounding the module test issue is the fact that, in general, stacked die packages are non-reworkable.
