References

Buhlmann, Peter & Domeinco Truncellito.  The back-end process: Step 4 - Die attach . Advanced Packaging . April, 2002

Reiche, Manfred & Wagner, Gerald. Wafer Thinning: Techniques for Ultra-thin Wafers . Advanced Packaging. March, 2003

Reid, Paul, Ivy Wei Qin, Paul Bereznycky and Jeff Swiatek. Providing Stacked Die Solutions with Wedge Bonding Technology . Singapore Semi 2002.

Smith, Lee and Ted Tessier. Stacked Chip-Scale Packages: They are Not Just for Cell Phones Anymore! Chip Scale Review , July 2001

Sturken, Keith, Shelia Konecke and Kent Mason. Bare Chip Stacking . Advanced Packaging , April 2003