References
System in Package (SiP) Assembly Contents
Buhlmann, Peter & Domeinco Truncellito. The back-end process: Step 4 - Die attach . Advanced Packaging . April, 2002
Reiche, Manfred & Wagner, Gerald. Wafer Thinning: Techniques for Ultra-thin Wafers . Advanced Packaging. March, 2003
Reid, Paul, Ivy Wei Qin, Paul Bereznycky and Jeff Swiatek.
Providing
Stacked Die Solutions with Wedge Bonding Technology . Singapore Semi 2002.
Smith, Lee and Ted Tessier. Stacked
Chip-Scale Packages: They are Not Just for Cell Phones Anymore! Chip Scale Review ,
July 2001
Sturken, Keith, Shelia Konecke and Kent Mason.
Bare Chip Stacking . Advanced Packaging , April 2003