Visual Inspection: Contamination or Foreign Material
Visual Inspection Contents
There shall be no Conductive (opaque) Foreign Material on the top of unglassivated die that is large enough to bridge two or more adjacent metallization areas, and that cannot be removed.
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There shall be no conductive (opaque) Foreign Material underthe top glassivation layer of the die that is large enough to bridge two or more adjacent metallization areas. |
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There shall be no attached or embedded material in die that bridges two active circuit elements.
GaAs: There shall be no attached or embedded material in die that reduces spacing of two active circuit elements by greater than 50 percent.
Silicon: There shall be no attached or embedded material in die that does not provide a visible line of separation between two active circuit elements.
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There shall be no liquid drops, chemical stains, ink or photoresist on top of unglassivated areas that bridges two active circuit elements. (Liquid drops, chemical stains, ink or photoresist on top of glassivated portion of the die are acceptable). |
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Courtesy Rockwell Collins