Visual Inspection: Glassification
Visual Inspection Contents
ACTIVE CIRCUIT - All areas from outside edge of the bond pads inward, except where there is an active line in the design located beyond the outside edge of the bond pads.
DIFFUSION - Electrical isolation of one or more active circuits.
GLASSIVATION - Top layer of transparent insulating material that covers active area except for bond pads.
PASSIVATION LAYER - Insulating material on die prior to deposition of metal or between metal layers.
Note: Some die by design may not have a glassivation layer.
There shall be no crazing or glassivation damage that prohibits visual inspection. There shall be no crazing or voids over a film resistor. There shall be no lifting or peeling more than 1.0 mil inside the active areas from the designed edge of the glassivation. There shall be no glassivation voids, cracks (not crazing) or scratches that exposes two or more adjacent active metallization paths. |
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There shall be no unglassivated area greater than 5.0 mils. There shall be no unglassivated area inside of active area which exposes bare semiconductor material. There shall not be glassivation over more than 25 percent of bond pad. |
There shall be no diffusion fault that allows bridging between diffused areas. |
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There shall be no breaks in diffusion (except isolation walls around unused areas or unused bonding pads). |
There shall be no reduction of diffusion greater than 75 percent (50 percent for resistors) of original width. (except isolation walls around unused areas or unused bonding pads) |
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There shall be no absence of glassivation over junction lines |
Courtesy Rockwell Collins