Visual Inspection: Cracks
Visual Inspection Contents
Chipouts on edge of die shall not penetrate into any active circuit area.
Note: Active circuit area is defined as from outside edge of the bond pads inward, except where
there is an active line in the design located beyond the outside edge of the bond pads.
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Cracks shall not be longer than 1.0 mil inside active circuit area that points toward operating metal or functional circuit element.
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Cracks that do not point toward operating metal or functional circuit elements shall not exceed 5.0 mils in length. (Silicon & GaAs Die)
GaAs (requirement only): There shall be no cracking or chipping within active circuit area.
There shall be no chipouts that extend beyond 50 percent of the substrate thickness or cracks in side walls greater than 5.0 mils.
Courtesy Rockwell Collins